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BGB203
Bluetooth System-in-a-Package radio with baseband controller
Rev. 1.0 -- 2005 July 28 Product Shortform Datasheet
Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
Product Shortform Datasheet
Rev. 1.0 -- 2005 July 28
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
Clocking
Product Shortform Datasheet
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
GND ANT GND GND GND GND GND GND GND GND GPIO[14] GPIO[12]
1
TCK_JTAG TDI_JTAG TDO_JTAG TMS_JTAG VDDIORF RESET_N GPIO[2] GPIO[4] GPIO[5] GPIO[3] DP_USB DN_USB 37
pin 49
13
BGB203
25
VDDIO2 VDDC GPIO[8] GPIO[6] GPIO[9] GPIO[7] GPIO[15] VBUS_USB XTAL2_LPO XTAL1_LPO VDDIO1 GPIO[16]
Fig 1. Package outline and pinning for the BGB203; dimensions 7 x 8 mm (top view)
Table 1: Pin nr. 1,3,4,5,6, 7,8,9,10,49 2 11 12 13 14 15 16 17 18 19 20 21 22
Pin description BGB203 Pin name GND ANT GPIO[14] GPIO[12] VDDRF GPIO[17] VANLO GPIO[1] / I2C_SDA GPIO[0] / I2C_SCL VDDA / VDDO XTAL2_SYS XTAL1_SYS GPIO[13] GPIO[11] O I I/O I/O Vddo Vddo I pull-up Vddio1 I pull-up Vddio1 I/O I/O I/O I/O I I I pull-up Vddio1 Vdda Vddio1 Vddio1 I/O I/O I/O I pull-up Vddio1 I pull-up Vddio1 I/O Reset state Supply domain Ground Antenna input / output General purpose I/O 14 General purpose I/O 12 Positive radio supply voltage General purpose I/O 17 Analog voltage source input General purpose I/O 1 I2C bus serial data General purpose I/O 0 I2C bus serial clock Positive analogue and oscillator supply voltage System clock crystal oscillator output System clock crystal oscillator input General purpose I/O 13 General purpose I/O 11 Description
Product Shortform Datasheet
VDDRF GPIO[17] VANLO GPIO[1] GPIO[0] VDDA/VDDO XTAL2_SYS XTAL1_SYS GPIO[13] GPIO[11] GPIO[10] VDDC/VDDIO1
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
I/O I/O Reset state O high Supply domain Vddio1 Description General purpose I/O 10 External system clock request Positive core and I/O1 supply voltage I/O I pull-up Vddio1 General purpose I/O 16 Oscillator mode selection (GND = slave mode) Positive core and I/O1 supply voltage I O I I/O I/O I/O I/O I/O I O high Vddio1 Vddio1 Vddio2 Vddio2 Low power clock crystal oscillator intput Low power clock crystal oscillator output USB Vbus detect General purpose I/O 15 External system clock request General purpose I/O 7 PCM/IOM frame sync General purpose I/O 9 Bidirectional PCM/IOM data line B (default: input) General purpose I/O 6 Bidirectional PCM/IOM data line A (default: output) General purpose I/O 8 PCM/IOM data clock Positive core supply voltage I/O2 supply voltage I/O I/O I/O I I O low Vddio2 Vddio2 Vddio2 USB data N USB data P General purpose I/O 3 UART request-to-send output USB soft connect General purpose I/O 5 UART receive input General purpose I/O 4 UART transmit output General purpose I/O 2 UART clear-to-send input USB LED 12MHz Clock output Reset input (active LOW) RF-BB interface supply voltage I O I I I pull-up Vddio1 O 3-state Vddio1 JTAG test mode select JTAG test data output JTAG test data input JTAG test clock
Table 1: Pin nr. 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
Pin description BGB203...continued Pin name GPIO[10] / SYS_CLK_REQ VDDC / VDDIO1 GPIO[16] / OSC_MODE VDDC / VDDIO1 XTAL1_LPO XTAL2_LPO VBUS_USB GPIO[15] SYS_CLK_REQ GPIO[7] FSC_IP GPIO[9] DB_IP GPIO[6] DA_IP GPIO[8] DCLK_IP VDDC VDDIO2 DN_USB DP_USB GPIO[3] RTS_UART CONNECT_USB GPIO[5] RXD_UART GPIO[4] TXD_UART GPIO[2] CTS_UART LED_USB CLK_EXT RESET_N VDDIORF TMS_JTAG TDO_JTAG TDI_JTAG TCK_JTAG
I pull-up Vddio2 I pull-up Vddio2 I pull-up Vddio2 I pull-up Vddio2
40 41 42
I/O I/O I/O
I pull-up Vddio2 I pull-up Vddio2 I pull-up Vddio2
43 44 45 46 47 48
I
I pull-up Vddio2
I pull-up Vddio1 I pull-up Vddio1
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
5. Block Diagram
ANT SYS OSC band pass filter Tx/Rx switch RX balun + filter LNA FLASH Limiter TX balun + filter DEMOD SYS PLL JTAG ETM RAM LPO OSC
GPIOs RC OSC USB I2C ARM7TDMI GPIO BRIDGE VANLO PATCH UART INT TIMER PA DIV 2 VCO
VCO Regulator
MOD BT CORE PCM
RF synth CNTL Loop Filter
Fig 2. Block diagram BGB203.
Product Shortform Datasheet
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
6. Limiting values
Table 2: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDRF VDDIORF VDDC / VDDIO1 VDDIO2 VDDC VDDO / VDDA VPINIOx VPINIO5V II Tamb Tstg Parameter RF supply voltage RF BB interface supply voltage Core & I/O 1 supply voltage I/O 2 supply voltage Core supply voltage Oscillator & Analog supply voltage Input voltage on any VDDIOx pin with respect to VSS Input voltage on 5V tolerant pins with respect to VSS Input current through any pin (except supply pins) Ambient temperature Storage temperature 30 40 Min 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Max +3.6 +2.5 +2.5 +4.6 +2.5 +2.5 VDDIOx +0.5 6.0 1 +85 +125 Unit V V V V V V V V mA C C
Table 3: Symbol Supplies VDDRF VDDIORF VDDC / VDDIO1 VDDC VDDIO2
AC/DC characteristics Parameter RF supply voltage RF BB interface supply voltage Core & I/O 1 supply voltage Core supply voltage I/O 2 supply voltage Conditions Min 2.65 1.65 1.65 1.65 1.65 1.65 Typ 2.75 1.8 1.8 1.8 1.8 / 3.3 1.8 Max 3.3 1.95 1.95 1.95 3.6 1.95 Unit V V V V V V
VDDO / VDDA Oscillator & Analog supply voltage Digital IOs at VDDIO1 Vih Vil Vhyst Voh Vol high level input voltage low level input voltage hysteresis voltage high level output voltage low level output voltage Ioh= 4mA Iol = 4mA 0.3 0.7
VDDIO1 0.3 VDDIO1 0.4 0.4 VDDIO1
V V V V V
VDDIO1
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
Conditions 0.7 0.3 Ioh= 4mA Iol = 4mA Min VDDIO2 0.3 VDDIO2 0.4 0.4 VDDIO2 VDDIO2 Typ Max Unit V V V V V
Table 3: Symbol
AC/DC characteristics...continued Parameter high level input voltage low level input voltage hysteresis voltage high level output voltage low level output voltage
Digital IOs at VDDIO2 Vih Vil Vhyst Voh Vol
Power dissipation and current consumption[1] Power system off active HV3 Baseband consumption Radio active HV3 Baseband consumption Radio active EV5 Baseband consumption Radio active EV5 Baseband consumption Radio ACL Sniff, Tsniff = 1024 (1.28s) active ACL oscillator is switched off Master[2]
All VDD=1.8V (except VDDRF) VDDRF = 2.75V
15 42.88 8.42 10.08 54.14 8.78 13.94 31.5 8.29 6.03 45.58 8.61 10.94 0.28 0.51 14.17
A mW mA mA mW mA mA mW mA mA mW mA mA mW mW mW
Slave[2]
All VDD=1.8V (except VDDRF) VDDRF = 2.75V
Master
All VDD=1.8V (except VDDRF) VDDRF = 2.75V
Slave
All VDD=1.8V (except VDDRF) VDDRF = 2.75V
Master Slave
ACL link Master, VDDRF=2.75V, Other VDDs =1.8V ACL link Slave, VDDRF=2.75V, Other VDDs =1.8V VDDRF=2.75V, Other VDDs =1.8V
active ACL
31.2
mW
Discoverable mode
2.12
mW
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
Table 4: tosc tpll tosc + tpll trst trc_delay tlong_reset tVDDx
Timing Parameter Xtal start up time lock time PLL Start up time with PLL locked baseband reset delay Minimal RF reset delay typical long reset duration Minimal VDD rise time Respons time to VDDRF supply
[3] [4]
Symbol
Conditions BGB203 BGB203 BGB203
Min 630[2] 880[2]
Typ
Max 682[1] 932[1]
Unit s s s cycles ns
1024 200 7.37 10 700 20
s s s
tregulator_respons
Table 5: Symbol
System and Low power oscillators Parameter system oscillator input frequency Voltage input swing DC input level High level input voltage on Xtal1_sys pin Low level input voltage on Xtal1_sys pin system oscillator input impedance system oscillator input capacitance to Ground system oscillator programmable capacitance to Ground tuning step size for programmable capacitance transconductance output impedance on XTAL2_SYS pin
slave mode [5] slave mode [1][4] bypass mode bypass mode slave mode [6] oscil. mode [2] slave mode [6]
[3]
Conditions
Min 12 300
Typ 13 or 24 950
Max 26 1700
Unit MHz mVpp mV V V kohm pF pF pF pF
System clock input fsys_xtal Vswing_sys VDC_sys VDD_sysIH VDD_sysIL Ri_sys_xtal Ci_sys_xtal Ci_tune_max Ci_steps gm_sys rout_sys
0.8VDDO 0
63 12 5 25 0.1 21 900
VDDO 0.2VDDO
40
mA/V ohm
Low power clock input flpo_xtal tstart,avg Vswing_lpo VDC_lpo VDD_lpoIH low power osc frequency LPO average start-up time low power input swing DC input level High level input voltage on Xtal1_lpo pin
oscil. mode oscil. mode slave mode [7] slave mode [7] bypass mode
32.768 6 320 320 0.8VDDO VDDO 1800
kHz ms mVpp mV V
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Product Shortform Datasheet
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
Conditions
bypass mode
Table 5: Symbol VDD_lpoIL lpo_acc Vthl(POR) Vthu(POR)
System and Low power oscillators...continued Parameter Low level input voltage on Xtal1_lpo pin LPO RC clock accuracy Calibrated Lower Power-on reset threshold voltage Upper Power-on reset threshold voltage
measured on pin VDDA/ VDDO measured on pin VDDA/ VDDO
Min 0 -
Typ 50 1.0 1.4
Max 0.2VDDO -
Unit V ppm V V
Table 6: Symbol Vref
Analog AI0 Parameter Voltage reference DAC output Voltage DAC output current
[1]
Conditions
Min
Typ 1.4
Max
Unit V
D/A converter Vanlo Ianlo DAC resolution ILE DLE A/D converter Vin Rin Radc Res Offset ILE DLE Integral Linearity Error Differential Linearity Error Input voltage Input resistor ADC input resistance ADC Resolution -1 -2 0
[2]
VSS 120
1.4 150 3 8
V A mA bits LSB LSB V Mohm Mohm
pull-up pull-down
DAC Integral Linearity Error DAC Differential Linearity Error
-2 -1 VSS 1 1
2 1 1.4
8 +1 +2 +1
bit LSB LSB LSB
Product Shortform Datasheet
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Philips Semiconductors
BGB203
Bluetooth radio module with baseband controller
Table 7: Symbol Vbg IddBG IddBGOff tBGbuffer
Analog Bandgap Parameter Bandgap Voltage Bandgap and ABV buffer consumption Bandgap and ABV buffer consumption with buffer disabled Bandgap buffer start-up time
to be measured on VDDA to be measured on VDDA
Conditions
Min 1.15 5 -
Typ 1.21 10 100
Max 1.25 20 25
Unit V A nA s
Table 8:
Radio [5] Parameter RF supply current Conditions
RX guard space RX (PLL off) TX guard space TX (PLL off) [4] power-down mode
Symbol Power consumption IDDRF
Min
Typ 18 33 18 29 1
Max
Unit mA
46 35 2.5 25 40 75 2480
mA mA mA A kHz kHz kHz MHz dBm
Frequency selection f1 slot f3, 5 slots ICFT fRF Po initial carrier frequency tolerance RF frequency Output power carrier drift
over 1 TX slot [2] over 3, 5 TX slots (DM3, DH3, DM5, DH5 packets) [2]
[2]
-25 -40 -75 2402 0 -5
0 0 0
Transmitter performance
over full temperature and supply range max. PA_CNTRL=7 nom. PA_CNTRL=4 min. PA_CNTRL=0
[2]
+5.5 0 -11 +4
dBm dBm dBm
step size Po 1 MHz adjacent channel output power
[7]
3
-45 -20
at 2 MHz offset [2] [3] at 3MHz offset and more[2] [3]
dBm
-50 fdev BW20dB VSWR frequency deviation 1111000 bit pattern 20 dB bandwidth voltage standing wave ratio
[2] [3] [2] [3]
-40 kHz 1 MHz
140 0.7 2
normalized to Z0 50
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BGB203
Bluetooth radio module with baseband controller
Conditions
30 MHz to 1 GHz [2] 1 GHz to 12.75 GHz [2] 1.8 GHz to 1.9 GHz [2] 5.15 GHz to 5.3 GHz [2]
Table 8: Spurious
Radio [5]...continued Parameter out of band spurious emissions (conducted) Min Typ Max 36 30 47 47 Unit dBm dBm dBm dBm
Symbol
Receiver performance SENS sensitivity for BER = 0.1 %
without carrier offset / hopping off with dirty transmitter as specified in note 3 [2]
-76 -76
88 -80
dBm dBm
sensitivity for PER = 0.5 % Pi max VSWR fRF C/ I maximum input power in one channel voltage standing wave ratio RF input frequency Co-channel
without carrier offset / hopping off BER < 0.1 % [2] normalized to Zo = 50
[2]
-76 -20 2402 +11
-80 -10 1.5 2481
dBm dBm
MHz dBc
N+/-1 N-2 N+2 N+3 N-3 and lower , N+4 and beyond OBB out of band blocking
0 -30 -9 -20
-10 -38 -30 -45 -48
dBc dBc dBc dBc dBc
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BGB203
Bluetooth radio module with baseband controller
Table 9: Parameter
ESD threshold voltages Method HBM (JESD22-A114-B) HBM (JESD22-A114-B)
[1]
Value 300 (V) 250 (V) 200 (V)
Class 2 1A 2
ESD threshold voltage
3500 (V) 2
MM (JESD22-A115-A) [1]
[2]
MM (JESD22-A115-A) [2]
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BGB203
Bluetooth radio module with baseband controller
Table 10: Rth j-a
ESD threshold voltages Method Thermal resistance from junction to ambient Value 30 Unit K/W
Parameter
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BGB203
Bluetooth radio module with baseband controller
10. Package outline
Fig 3.
Package outline.
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BGB203
Bluetooth radio module with baseband controller
48 1
37 36
12 13 24
25
Fig 4.
PCB Footprint outline, metal defined.
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BGB203
Bluetooth radio module with baseband controller
11. Soldering
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BGB203
Bluetooth radio module with baseband controller
Critical Zone
Temperature
TP
Ramp-up
TL to TP
TL
Ts max
tL
Ts min
tS
Preheat
Ramp-down
25
t 25C to peak
Time
Following reflow profile and constraints are recommended for eutectic Sn/Pb and Pb-free reflow solders. Eutectic Sn/Pb Pb-free Average Ramp-Up Rate 2 C/second max. 2 C/second max *. (Tsmax to Tp) Preheat - Temperature Min (Tsmin) 100 C 150 C - Temperature Max (Tsmax) 150 C 200 C - Time (tsmin to tsmax) 60-120 seconds 75-90 seconds ( 0.75C/second) Time maintained above: - Temperature (TL) 183 C 217 C - Time (tL) 60-90 seconds 70-90 seconds Max. Peak Temperaure (Tp) 240 +0/-5 C 260 +0 C Time within 5 C of actual Peak 10-30 seconds 20-30 seconds Temperature (tp) Ramp-Down Rate > 180 C: 2 C/second > 180 C: 2 C/second max *. max. < 180 C: 6 C/second max. < 180 C: 6 C/second max. Minimum peak temperature 205 C 230 C (Tpmin) Time 25C to TpTp Tp Tp Tp 4-5 minutes 4-5 minutes *Ramp-up and -down is lower than specified in JEDEC JSTD-020C.
Fig 5. Recommended reflow temperature profile.
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BGB203
Bluetooth radio module with baseband controller
Maximum peak temperature (Tmax) 240C 250C 260C
MSL MSL3 MSL3 MSL3
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Bluetooth radio module with baseband controller
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BGB203
Bluetooth radio module with baseband controller
12. Packing
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BGB203
Bluetooth radio module with baseband controller
Table 11: Rev
Revision history Date CPCN Product Shortform Datasheet Description
1.0 20050728
Table 12:
Ordering information Package Name Description Version
Type number
BGB203/1
SOT 863-1
Bluetooth radio module with baseband controler; 12 nc: 9340 592 93518
S01
Data sheet status
Product status
Definitions
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
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BGB203
Bluetooth radio module with baseband controller
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BGB203
Bluetooth radio module with baseband controller
General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Radio hardware . . . . . . . . . . . . . . . . . . . . . . . . 2 Baseband hardware . . . . . . . . . . . . . . . . . . . . . 2 Hardware features . . . . . . . . . . . . . . . . . . . . . . 2 Firmware features. . . . . . . . . . . . . . . . . . . . . . . 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Full SiP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . 7 Timing characteristics. . . . . . . . . . . . . . . . . . . . 9 Analog characteristics . . . . . . . . . . . . . . . . . . . 9 Radio characteristics . . . . . . . . . . . . . . . . . . . 11 ESD precautions . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal characteristics. . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 PCB footprint outline. . . . . . . . . . . . . . . . . . . . 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Ordering information . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22
1 2 2.1 2.2 2.3 2.3.1 2.3.2 3 4 4.1 4.2 5 5.1 6 7 7.1 7.2 7.3 8 9 10 10.1 11 12 13 14 15 16
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